1.铜基:采用进口精炼韧性无氧铜/T2紫铜,含铜量≥99.99%,导电率≥98%
2.铜基电阻率:无氧铜≤0.0165Ωmm2/m,T2紫铜≤0.0172Ωmm2/m
3.涂层成分: 62%Sn36%Pb2%Ag
4.涂层厚度:单面涂层0.01~0.05mm,涂层均匀,表面光亮、平整
5.涂层熔点:179℃
6.抗拉强度:≥200N/mm2
7.延伸率:≥20%
1.Copper:Imported oxygen free or T2 copper ,Cu≥99.99%,Conductivity≥98%
2.Resistivity:Oxygen free copper≤0.0165Ωmm2/m,T2 copper≤0.0172Ωmm2/m
3.Coat Component: 62%Sn36%Pb2%Ag
4.Coat Thickness(Single side):0.01~0.05mm,uniform,smooth,bright
5.Coat Melting Point:179℃
6.Tensile Strength:≥200N/mm2
7.Elongation:≥20%